ASML, TSMC Push 12-Inch Photomasks as High-NA EUV Enters Next Phase
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September 9, 2026 -- Today’s top stories: ASML, TSMC Push 12-Inch Photomasks as High-NA EUV Enters Next Phase, Chinese EV Maker XPeng Launches Humanoid Robot Production Line, and Japan Consortium Extends Perovskite Solar Cell Life by 50%.
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ASML, TSMC Push 12-Inch Photomasks as High-NA EUV Enters Next Phase
By CommonWealth Magazineweb only
ASML, TSMC Push 12-Inch Photomasks as High-NA EUV Enters Next Phase
ASML and TSMC are spearheading an industry-wide transition to larger 12-inch photomasks for High Numerical Aperture (High-NA) EUV lithography, as chipmakers prepare for the next stage of semiconductor scaling. Samsung has joined the initiative, while Intel has already pioneered High-NA EUV in production. The shift is aimed at overcoming manufacturing constraints that could become increasingly important as AI and high-performance computing drive demand for larger, denser and more complex chips.
High-NA EUV increases the numerical aperture from 0.33 in conventional EUV systems to 0.55, allowing finer circuit features to be printed. Intel has already deployed the technology on selected layers of its 18A-based Core Ultra Series 3 processors. Samsung plans to introduce High-NA EUV into high-volume DRAM manufacturing by 2028, while TSMC expects to deploy it for advanced-node high-volume manufacturing starting in 2030, with usage increasing as AI-related transistor architectures become more complex.
Initially, High-NA systems will continue using the semiconductor industry's standard 6-inch photomasks. However, High-NA's optical architecture produces a smaller exposure field, meaning sufficiently large chips may require separate exposures that are subsequently joined through stitching. Moving to 12-inch masks could restore a larger exposure field, removing stitching constraints and making High-NA more suitable for the large dies increasingly used in AI accelerators and data-center processors.
The economic payoff could be substantial. ASML CTO Marco Pieters told Reuters that a successful industry transition to larger masks could boost the productivity of High-NA systems by about 40%. Higher throughput would help offset the escalating cost of leading-edge semiconductor manufacturing and potentially make it economical for chipmakers to employ High-NA EUV across more layers. The larger masks could therefore become important not only for extending transistor scaling but also for improving the economics of producing advanced chips.
The transition will require cooperation across the semiconductor ecosystem because larger masks will affect mask manufacturing, inspection, metrology, handling and other supporting infrastructure. ASML and TSMC aim to establish a 12-inch photomask pilot line by 2031, paving the way for 12-inch High-NA lithography systems to enter advanced-node production by 2033. The roadmap effectively creates a two-stage High-NA transition: chipmakers will first adopt the technology with existing masks, then migrate to a larger mask platform designed to unlock its full productivity and manufacturing potential.
Reference Sources
- Trendforce - ASML Expands High-NA EUV Push with TSMC, Samsung and Intel; 12-inch Photomask Pilot Line Set for 2031
- Samsung and TSMC to adopt ASML’s High NA EUV technology to advance chip production
- TSMC Press Release
Chinese EV maker XPeng puts humanoid robot production line into operation
Chinese electric vehicle maker Xpeng has launched a production line for Humanoid robots, aiming to begin sales and deliveries of these robots in both China and overseas markets by 2027.
The company's advanced general-purpose Humanoid robot iron completed automated final assembly and walked off the production line on its own at the launch, marking Xpeng's shift from R&D and trial production to line-based manufacturing. Mass production has been a major challenge for the Humanoid-robot industry, which has traditionally depended on small-batch manufacturing and labor-intensive semi-manual assembly.
The company said the production line was designed specifically for large-scale robot manufacturing, drawing on quality-control practices used in the auto industry.
Xpeng Chairman He Xiaopeng said the company had built the robot production line from scratch and would continue working to shorten production cycles and expand manufacturing capacity.
After entering mass production, iron robots will initially be deployed at Xpeng stores and internal industrial parks.
They are expected to handle tasks including customer reception, vehicle introductions, visitor guidance, inspections and small-item handling.
Xpeng said the robots will be tested first in its own commercial and industrial settings, allowing the company to refine their algorithms through real-world use before a broader market rollout in 2027.
Reference Sources
- xinhua - Chinese EV maker XPeng puts humanoid robot production line into operation
- xinhua - XPeng starts humanoid robot production line, targets mass production by year-end
Japan consortium extends perovskite solar cell life by 50%
Toshiba, Shin-Etsu chemical, and Niigata University have developed a Perovskite solar cell that is 1.5 times more durable than existing alternatives, giving it the world's highest durability and an edge in the competition with Chinese manufacturers currently leading the race to mass-produce next-generation solar cells.
The long-life Perovskite solar cells are expected to hit markets in the 2030S.
Toshiba developed the cell, while Shin-Etsu makes the casing that protects the cell.
Niigata University developed the casing technology that helped improve the cell's durability.
The new technology to be commercialized features a tandem cell that combines a Perovskite layer and a silicon cell layer. Theoretically, a tandem cell offers roughly 30% better power generation efficiency than a thin, foldable film solar cell.
The prototype the three partners are currently testing has a cell unit of 25 square millimeters. For commercial production, they will test whether a module with a cell unit larger than 250 square centimeters is capable of delivering the same performance as the prototype.
The team hopes to increase the durability to more than 20 years before commercialization. Testing has confirmed that the new cells are 1.5 times more durable than existing products.
Reference Sources
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